Materials and devices require testing and characterization for their intended use and intended properties targeted in the design of smart material. A wide range scanning and transmission electron microscopy (SEM and TEM) tool provides the resolution required to qualify these materials. Structural information, such as morphology and crystallography, as well as chemical, magnetic and electrical, strain and stress information can be obtained with various degrees of resolution and a wide variety of sample classes.
DualBeam™ SEM/FIB microscopy adds the power of a focused ion beam (FIB) for site-specific cross-sectioning, in order to gain a better understanding of the materials below their surfaces. Sub-surface imaging can be performed statically or dynamically, and responses of the material to changing physical and chemical conditions, (such as testing under stress/ strain, heating/ cooling and environmental reactive gaseous conditions) can be studied at all levels of detail—down to the atomic level—with real time observation of materials' properties changes, compositional analysis for materials characterization and high-resolution images.
FEI systems with models for materials and device testing and characterization include the following: